先进封装：创新的核心

    先进封装及系统研讨会    

04/22 - 04/23 上海

#5G #transportation #memory #AI #artificialintellince #consumer #consumer #HPC #highcomputing #advancedpackaging #fanout #fanin #wlpc #wlp #flipchip #substrate #wafer #semiconductors 

#packagingplatform #PCB #advancedsubstrate #technologytrends #industryevolution #innovations #innovation #marketresearch #analysts #leadinginnovation #technology #packaging #china #advanced 

Yole Développement和华进NCAP中国决定再次结合他们的专业知识，在NEPCONChina中国国际电子生产设备暨微电子工业展之前在上海举办先进封装和系统集成技术研讨会。

#marketresearch #analysts #leadinginnovation #technology #packaging #china #advanced 

主办单位要感谢其赞助厂商：

BESI

SPTS

Orbotech

ULVAC

ASM

BOWMAN

HANMI

ERS Electronic

KULICKE＆SOFFA

完整日程和报名详情请洽： https://www.i-micronews.com/event/advanced-packaging-system-integration-technology-symposium/

 #packagingplatform #PCB #advancedsubstrate #technologytrends #industryevolution #innovations #innovation #marketresearch #analysts #leadinginnovation #technology #packaging #china #advanced